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Chen, Weimin, McCloskey, Paul, Rohan, James F., Byrne, Patrick and McNally, Patrick J. orcid logoORCID: 0000-0003-2798-5121 (2007) Preparation and temperature cycling reliability of electroless Ni(P) under bump metallization. IEEE Transactions on Components and Packaging Technologies, 30 (1). pp. 144-151. ISSN 1521-3331

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