McNally, Patrick J. ORCID: 0000-0003-2798-5121, Rantamäki, R., Tuomi, Tiinamaija, Danilewsky, Andreas N., Lowney, Donnacha, Curley, John W. and Herbert, P.A.F. (2001) Mapping of mechanical, thermomechanical and wire-bond strain fields in packaged Si integrated circuits using synchrotron white beam x-ray topography. IEEE Transactions on Components and Packaging Technologies, 24 (1). pp. 76-83. ISSN 1521-3331

Curley, John W. (1995) Oxidation studies on supported metal catalysts. PhD thesis, Dublin City University.